 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| PD - 95252 SMPS MOSFET Applications Reset Switch for Active Clamp Reset DC to DC converters l Lead-Free l IRF6217PBF HEXFET(R) Power MOSFET RDS(on) max 2.4W@VGS =-10V VDSS -150V ID -0.7A Benefits Low Gate to Drain Charge to Reduce Switching Losses l Fully Characterized Capacitance Including Effective COSS to Simplify Design (See App. Note AN1001) l Fully Characterized Avalanche Voltage and Current l S 1 8 A D D D D S S G 2 7 3 6 4 5 Top View SO-8 Absolute Maximum Ratings Parameter ID @ TA = 25C ID @ TA = 70C IDM PD @TA = 25C VGS dv/dt TJ TSTG Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Power Dissipation Linear Derating Factor Gate-to-Source Voltage Peak Diode Recovery dv/dt Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Max. -0.7 -0.5 -5.0 2.5 0.02 20 4.5 -55 to + 150 300 (1.6mm from case ) Units A W W/C V V/ns C Thermal Resistance Symbol RJL RJA Parameter Junction-to-Drain Lead Junction-to-Ambient Typ. --- --- Max. 20 50 Units C/W Notes through are on page 8 www.irf.com 1 10/04/04 IRF6217PBF Static @ TJ = 25C (unless otherwise specified) Parameter Drain-to-Source Breakdown Voltage V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient RDS(on) Static Drain-to-Source On-Resistance VGS(th) Gate Threshold Voltage V(BR)DSS IDSS IGSS Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Min. -150 --- --- -3.0 --- --- --- --- Typ. --- -0.17 --- --- --- --- --- --- Max. Units Conditions --- V VGS = 0V, ID = -250A --- V/C Reference to 25C, I D = -1mA 2.4 VGS = -10V, ID = -0.42A -5.0 V VDS = VGS, ID = -250A -25 VDS = -150V, VGS = 0V, TJ = 25C A -250 VDS = -120V, VGS = 0V, TJ = 125C -100 VGS = -20V nA 100 VGS = 20V Dynamic @ TJ = 25C (unless otherwise specified) gfs Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Coss Coss Coss eff. Parameter Forward Transconductance Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Output Capacitance Output Capacitance Effective Output Capacitance Min. 0.55 --- --- --- --- --- --- --- --- --- --- --- --- --- Typ. --- 6.0 1.6 2.8 12 7.2 14 16 150 30 10 150 15 45 Max. Units Conditions --- S VDS = -50V, ID = -0.42A 9.0 ID = -0.42A 2.4 nC VDS = -120V 4.2 VGS = -10V, --- VDD = -75V --- ID = -0.42A ns --- RG = 6.2 --- VGS = -10V --- VGS = 0V --- VDS = -25V --- pF = 1.0KHz --- VGS = 0V, VDS = -1.0V, = 1.0KHz --- VGS = 0V, VDS = -120V, = 1.0KHz --- VGS = 0V, VDS = 0V to -120V Avalanche Characteristics Parameter EAS IAR Single Pulse Avalanche Energy Avalanche Current Typ. --- --- Max. 15 -1.4 Units mJ A Diode Characteristics IS ISM VSD trr Qrr Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge Min. Typ. Max. Units --- --- --- --- --- --- --- --- 51 86 -1.8 A -5.0 -1.6 77 130 V ns nC Conditions MOSFET symbol showing the G integral reverse p-n junction diode. TJ = 25C, IS = -0.42A, VGS = 0V TJ = 25C, IF = -0.42A di/dt = -100A/s D S 2 www.irf.com IRF6217PBF 10 TOP VGS -15V -12V -10V -8.0V -7.0V -6.0V -5.5V -5.0V 10 TOP -I D, Drain-to-Source Current (A) -I D, Drain-to-Source Current (A) BOTTOM BOTTOM VGS -15V -12V -10V -8.0V -7.0V -6.0V -5.5V -5.0V 1 1 0.1 -5.0V 0.1 -5.0V 20s PULSE WIDTH T J= 25 C 0.01 0.1 1 10 100 20s PULSE WIDTH T J= 150 C 0.01 0.1 1 10 100 -V DS, Drain-to-Source Voltage (V) -V DS Drain-to-Source Voltage (V) , Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 10 2.5 I D = -0.70A 2.0 -I D, Drain-to-Source Current (A) TJ = 25 C 1 TJ = 150 C RDS(on) , Drain-to-Source On Resistance (Normalized) 1.5 1.0 0.1 0.5 V DS -50V = 20s PULSE WIDTH 0.01 4 5 7 8 9 11 12 V GS = -10V 0.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 -V GS Gate-to-Source Voltage (V) , TJ , Junction Temperature ( C) Fig 3. Typical Transfer Characteristics Fig 4. Normalized On-Resistance Vs. Temperature www.irf.com 3 IRF6217PBF 10000 VGS = 0V, f = 1 MHZ Ciss = C + Cgd, C gs ds SHORTED Crss = C gd Coss = C + Cgd ds -V GS , Gate-to-Source Voltage (V) 8 12 ID = -0.42A 10 VDS = -120V VDS = -75V VDS = -30V 1000 C, Capacitance(pF) 100 Ciss 6 Coss 10 4 Crss 2 1 1 10 100 1000 0 0 2 4 6 8 -VDS, Drain-to-Source Voltage (V) QG , Total Gate Charge (nC) Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage 10 100 -I D , Drain-to-Source Current (A) OPERATION IN THIS AREA LIMITED BY R DS(on) 10 -I SD, Reverse Drain Current (A) TJ = 150 C 1 1 100sec 1msec 0.1 Tc = 25C Tj = 150C Single Pulse 1 10 100 T = 25 C J 10msec V GS= 0 V 0.1 0.2 0.6 0.9 1.3 1.6 0.01 1000 -V SD,Source-to-Drain Voltage (V) -V DS , Drain-toSource Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage Fig 8. Maximum Safe Operating Area 4 www.irf.com IRF6217PBF 1.0 VDS 0.8 RD VGS RG D.U.T. + -I D , Drain Current (A) 0.6 VGS 0.4 Pulse Width 1 s Duty Factor 0.1 % Fig 10a. Switching Time Test Circuit 0.2 VDS 90% 0.0 25 50 75 100 125 150 TC , Case Temperature ( C) Fig 9. Maximum Drain Current Vs. Ambient Temperature 10% VGS td(on) tr t d(off) tf Fig 10b. Switching Time Waveforms 100 (Z thJA ) D = 0.50 10 0.20 0.10 Thermal Response 0.05 0.02 0.01 1 SINGLE PULSE (THERMAL RESPONSE) P DM t1 t2 Notes: 1. Duty factor D = 2. Peak T t1/ t 2 +T A 10 J = P DM x Z thJA 0.1 0.0001 0.001 0.01 0.1 1 t 1, Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient www.irf.com - V DD 5 IRF6217PBF R DS(on) , Drain-to -Source On Resistance ( ) RDS (on) , Drain-to-Source On Resistance ( ) 1.94 9.00 8.00 7.00 6.00 5.00 4.00 1.92 1.90 1.88 VGS = -10V 1.86 1.84 ID = -0.7A 3.00 2.00 1.00 4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0 1.82 1.80 0.00 0.25 0.50 0.75 1.00 1.25 1.50 -I D , Drain Current (A) -V GS, Gate -to -Source Voltage (V) Fig 12. On-Resistance Vs. Drain Current Current Regulator Same Type as D.U.T. Fig 13. On-Resistance Vs. Gate Voltage 50K 12V .2F .3F -VGS QGS + D.U.T. VDS QG QGD 35 VG TOP VGS -3mA Charge 30 BOTTOM IG ID ID -0.6A -1.1A -1.4A EAS , Single Pulse Avalanche Energy (mJ) Current Sampling Resistors 25 Fig 14a&b. Basic Gate Charge Test Circuit and Waveform 20 15 VDS L 10 I AS RG D.U.T IAS VDD A DRIVER 5 -20V tp 0.01 0 25 50 75 100 125 150 tp V(BR)DSS 15V Starting Tj, Junction Temperature ( C) Fig 15a&b. Unclamped Inductive Test circuit and Waveforms Fig 15c. Maximum Avalanche Energy Vs. Drain Current 6 www.irf.com IRF6217PBF SO-8 Package Outline Dimensions are shown in millimeters (inches) D A 5 B DIM A b INCHES MIN .0532 .013 .0075 .189 .1497 MAX .0688 .0098 .020 .0098 .1968 .1574 MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 4.00 A1 .0040 8 6 E 1 7 6 5 H 0.25 [.010] A c D E e e1 H K L y 2 3 4 .050 BASIC .025 BASIC .2284 .0099 .016 0 .2440 .0196 .050 8 1.27 BASIC 0.635 BASIC 5.80 0.25 0.40 0 6.20 0.50 1.27 8 6X e e1 A C 0.10 [.004] 8X b 0.25 [.010] A1 CAB y K x 45 8X L 7 8X c NOT ES : 1. DIMENS IONING & TOLERANCING PER ASME Y14.5M-1994. 2. CONT ROLLING DIMENS ION: MILLIMET ER 3. DIMENS IONS ARE SHOWN IN MILLIMETERS [INCHES]. 4. OUTLINE CONFORMS TO JEDEC OUTLINE MS -012AA. 5 DIMENS ION DOES NOT INCLUDE MOLD PROT RUSIONS . MOLD PROTRUS IONS NOT TO EXCEED 0.15 [.006]. 6 DIMENS ION DOES NOT INCLUDE MOLD PROT RUSIONS . MOLD PROTRUS IONS NOT TO EXCEED 0.25 [.010]. 7 DIMENS ION IS T HE LENGT H OF LEAD FOR SOLDERING TO A S UBST RAT E. 3X 1.27 [.050] F OOTPRINT 8X 0.72 [.028] 6.46 [.255] 8X 1.78 [.070] SO-8 Part Marking EXAMPLE: T HIS IS AN IRF7101 (MOSFET ) DAT E CODE (YWW) P = DES IGNAT ES LEAD-FREE PRODUCT (OPT IONAL) Y = LAS T DIGIT OF T HE YEAR WW = WEEK A = AS S EMBLY S IT E CODE LOT CODE PART NUMBER INT ERNAT IONAL RECT IFIER LOGO XXXX F7101 www.irf.com 7 IRF6217PBF SO-8 Tape and Reel Dimensions are shown in millimeters (inches) TERMINAL NUMBER 1 12.3 ( .484 ) 11.7 ( .461 ) 8.1 ( .318 ) 7.9 ( .312 ) FEED DIRECTION NOTES: 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. 330.00 (12.992) MAX. 14.40 ( .566 ) 12.40 ( .488 ) NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. OUTLINE CONFORMS TO EIA-481 & EIA-541. Notes: Repetitive rating; pulse width limited by max. junction temperature. Pulse width 400s; duty cycle 2%. When mounted on 1 inch square copper board. Starting TJ = 25C, L = 15mH RG = 25, IAS = -1.4A. Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualifications Standards can be found on IR's Web site. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.10/04 8 www.irf.com |
Price & Availability of IRF6217PBF
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |